The BONDCHECK is a multi-mode bond testing flaw detector providing high speed inspection in pitch-catch, resonance and MIA bond testing modes, with excellent defect sensitivity.
Ergonomically designed and manufactured from CNC machined Aluminium with rubber hand grips, the BondCheck Pitch-Catch probe is both comfortable to use and robust; whilst offering the best in performance and durability.
The probe feet can be positioned by the user to suit the inspection task, and the hard wearing probe tips are interchangeable with rounded and flat tip profiles available. The probe is broad band and is suitable for a wide range of applications.
Resonance mode is ideal for inspection of bonded aluminium lap joints commonly found in aerospace structures such as wing and aileron stiffeners, and has good penetration through multi-layered structures and adhesive bond lines. Available in a number of frequencies (75, 90, 165, 200, 250 and 330kHz), supplied as a 6 probe kit or individually.
The MIA technique is particularly useful for small defect detection, using a dry coupled probe with a small contact area. The technique offers excellent near surface defect sensitivity and is particularly suitable for top surface skin to core dis-bond detection for composite as well as metallic honeycomb structures.